中文摘要：

Cu 和 Ni 原子经历 liquid–solid electromigration (L-S 他们) 的散开行为用 Cu/Sn/Ni 被调查在 5.0 ×10 ³ 在 250 °C 的 ² 。电子的流动方向显著地影响 Cu 和 Ni 原子的跨 solder 相互作用，即在顺风的散开下面， Cu 和 Ni 原子能扩散到相反的接口；当在迎风的散开， Cuatoms 然而并非 Ni 下面原子能扩散到相反的接口时。当电子从 Cu 流动到 Ni 时，仅仅 Cu 原子扩散到相反的阳极 Ni 接口，导致从 Ni ₃ Sn ₄进( Cu ， Ni ) ₆ Sn ₅并且进进一步[( Cu ， Ni ) ₆ Sn ₅+Cu₆ Sn ₅],当 noNi 原子扩散到相反的阴极 Cu 接口并且这样时界面的 Cu ₆ Sn ₅留下了。从 Ni 的 Whenelectrons 流动到 Cu ， Cu 和 Ni 原子扩散到相反的接口， resultingin 从起始的 Cu ₆ Sn ₅进( Cu ， Ni ) ₆ Sn ₅并且进进一步[( Cu ， Ni ) ₆ Sn ₅+(Ni,Cu)₃在阳极 Cu 接口的 Sn ₄]当时那从起始的 Ni ₃ Sn ₄进( Cu ， Ni ) ₆ Sn ₅并且进进一步( Ni ， Cu ) ₃在阴极 Ni 接口的 Sn ₄损坏，电子比另外的方法从 Cu 流动到 Ni 是更多的。

英文摘要：

The diffusion behavior of Cu and Ni atoms undergoing liquidesolid electromigration（L-S EM） was investigated using Cu/Sn/Ni interconnects under a current density of 5.0 103A/cm2 at 250℃. The flowing direction of electrons significantly influences the cross-solder interaction of Cu and Ni atoms, i.e., under downwind diffusion, both Cu and Ni atoms can diffuse to the opposite interfaces; while under upwind diffusion,Cu atoms but not Ni atoms can diffuse to the opposite interface. When electrons flow from the Cu to the Ni, only Cu atoms diffuse to the opposite anode Ni interface, resulting in the transformation of interfacial intermetallic compound（IMC） from Ni3Sn4into（Cu,Ni）6Sn5and further into [（Cu,Ni）6Sn5t Cu6Sn5], while no Ni atoms diffuse to the opposite cathode Cu interface and thus the interfacial Cu6Sn5 remained.When electrons flow from the Ni to the Cu, both Cu and Ni atoms diffuse to the opposite interfaces,resulting in the interfacial IMC transformation from initial Cu6Sn5into（Cu,Ni）6Sn5and further into[（Cu,Ni）6Sn5t（Ni,Cu）3Sn4] at the anode Cu interface while that from initial Ni3Sn4into（Cu,Ni）6Sn5and further into（Ni,Cu）3Sn4at the cathode Ni interface. It is more damaging with electrons flowing from the Cu to the Ni than the other way.