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Intermediate gas phase of CH4/[Si(CH3)2O]5 plasma and its effect on SiCOH films structure
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  • 相关项目：纳电子器件中超低k多孔SiCOH薄膜的ECR等离子体加工及相关复杂性研究
同期刊论文项目
纳电子器件中超低k多孔SiCOH薄膜的ECR等离子体加工及相关复杂性研究
期刊论文 28 会议论文 1
同项目期刊论文
Structure characterization of HSQ films for low dielectric uses D4 as sacrificial porous materials
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CHx掺杂SiCOH 低介电常数薄膜的物性热稳定性分析
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improvement of electrical properties of Cu/SiCOH low-k film integrated system by O2 plasma treatment
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Effect of CHF3 Plasma Treatment on the Characteristics of SiCOH Low-k Film
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Effect of C：F Deposition on Etching of SiCOH Low-k Films in CHF3 60 MHz/2 MHz Dual-Frequency Capacitively Coupled Plasma
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