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Structure characterization of HSQ films for low dielectrics using D5 as sacrificial porous materials
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  • 相关项目：纳电子器件中超低k多孔SiCOH薄膜的ECR等离子体加工及相关复杂性研究
同期刊论文项目
纳电子器件中超低k多孔SiCOH薄膜的ECR等离子体加工及相关复杂性研究
期刊论文 28 会议论文 1
同项目期刊论文
Intermediate gas phase of CH4/[Si(CH3)2O]5 plasma and its effect on SiCOH films structure
Structure characterization of HSQ films for low dielectric uses D4 as sacrificial porous materials
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