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Processing of WC-Co Cemented Carbide Balls by Rotated Dual-Plates Lapping Machine
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  • 相关项目：先进陶瓷精密高效加工技术基础研究
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先进陶瓷精密高效加工技术基础研究
期刊论文 60 会议论文 7 获奖 4 著作 2
同项目期刊论文
Research on the Correlation between the Surface Quality and the Abrasive Grains Wear in Dual-Lapping
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Lapping of WC-Co Cemented Carbide Ball by Eccentric Dual-Rotating V-Groove Lapping Mode
Research and simulation on the wear uniformity of lapping plate
Simulation of Compacting Process for Semi-Fixed Abrasive Wheel
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An Investigation to Semi-Fixed Abrasives Plate Characteristics
Observation in the Surface Roughness of Silicon Wafer during Semi-Fixed Abrasive Machining with Larg
半固着磨具孔隙率的理论分析及验证
Research on Ultra-precision Lapping Technology for Super-smooth Surface of KTP Crystal
Simulation Study on the Developed Eccentric V-grooves Lapping Mode for Precise Ball
Study on Pad Conditioning Parameters in Silicon Wafer CMP Process
半固着磨粒加工工艺参数对“陷阱”效应影响的离散元模拟
不锈钢平面的半固着磨粒加工
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浮力磨粒球性能对工件抛光影响的实验研究
Study on the Mechanical Properties of Sapphire by Numerical Simulation and Nanoindentation Technolog
Processing of WC-Co Cemented Carbide Ball by EDR and RDP Lapping Modes
Surface Lapping by Semi-Bonded Abrasive Grinding Plate for Copper Substrates of Amorphous Ni-Pd-P Al
Study on Fixed Abrasive Lapping Technology for Ceramic Balls
半固着磨具"陷阱"效应的颗粒流模拟
蓝宝石衬底双面研磨的材料去除机理研究
磨粒的几何形状研究综述
Research on Mechanism of Chemical Mechanical Polishing Process for licon Nitride Balls with CeO2 Abr
Study on Roundness Error Correction for the Ceramic Ball in Rotated Dual-plates Lapping Process
Particle Flow Simulation on the Influences of Property Parameters of Semi-Fixed Abrasive Plate on it
Current Situation and Trend of Ultra-precision abrasive machining
超精密加工现状综述
磨粒粒径对蓝宝石研磨均匀性影响的试验研究
CMP 抛光液流场数值仿真
半固着磨具在非晶态Ni-Pd-P合金薄膜铜片衬底精密研磨中的应用
平面研磨抛光轨迹研究
蓝宝石的纳米压痕试验与有限元仿真研究
Semi-Fixed Abrasive Machining for Plane Aluminium
The Characteristic of Organic Bond Grinding Wheel
An Approach to the Influence of Flotative Abrasive Balls on Polishing Process
Machining Characteristics of Semibonded Abrasive Grinding Plate
Study on the Abrasive Effecting Factors of the Removal Rate during Dual-Lapping Sapphire Wafer
Examination to Machining Characteristics of Semi-Fixed Abrasive Plate during the Lapping Process
Study on Semi-Fixed Abrasive Lapping of Ultra-Thin Silver Electrode Layer
Experimental Validation of the ‘Trap’ Effect of the Semibonded Abrasive Grinding Plate
Simulation on the Indentation of Large Grain in the Semi-Fixed Abrasive Plate with Discrete Element
Simulation and Analysis for Application of Truing Ring in Certain Eccentricity Plane Lapping System
On the Evaluation of Lapping Uniformity for Precision Balls
Comparison of Processing Features between Semi Bonded Abrasive Lapping and Loose Abrasive Lapping
Theoretical Research and Verification on the Porosity of Semi-Fixed Abrasive Tool
Application of Taguchi Method for Optimization of Finishing Conditions in SUS440 Stainless Steel Sub
Experimental Study on the Ultraprecision Lapping Technology of the Copper Substrates for Alloy Films
Parameters Optimization on the Lapping Process for Advanced Ceramics by Applying Taguchi Method
Research on Chemical Mechanical Polishing for Silicon Nitride Ceramics
氮化硅陶瓷球化学机械抛光机理的研究
基于ADAMS的球体双自转研磨方式下研磨盘转速优化研究
双自转研磨沟槽结构参数对球体研磨均匀性的影响分析
半固着磨具“陷阱”效应的颗粒流模拟
超精密加工领域科学技术发展研究
蓝宝石衬底研磨加工中研磨盘材质的影响
蓝宝石晶体的双面研磨加工
半固着磨具“陷阱”效应影响因素分析