以马氏体不锈钢SUS440C为加工对象,使用#3000碳化硅磨粒进行半固着磨粒和游离磨粒加工。半固着磨具与工件的接触采用面-面接触方式,半固着磨具使用SSB结合剂,磨粒重量浓度为60%.孔隙率为70%。游离磨粒加工中研具材料为球墨铸铁。两种加工方法中,加工开始10min后工件表面粗糙度迅速由Ra0.2μm左右降低至Ra0.07μm以下,加工30min后工件表面质量趋于稳定。工件表面质量主要取决于磨粒粒度与加工时间,加工载荷与磨具/研具转速的影响较小。半固着磨粒加工可获得比游离磨粒加工更高的表面质量。
Mechanical polishing experiment was carried out on martensitic stainless steel, SUS 440C, by semi-bonded and loose abrasives machining technology using green silicon carbide grits with size of #3000. The contact mode of workpieee and semi-bonded abrasive plate is plane-plane, the bonding agent is SSB, the concentration of abrasives grits is 60 wt% , and the porosity is 70%. The material of lapping board used in loose abrasives machining is ductile cast iron. During semi-bonded or loose abrasive machining, the surface roughness of workpieces decreases from nearly Ra 0. 2 μm to lower than Ra 0. 07 μm after 10 minutes processing, and tends to the minimum value after 30 minutes processing. It is found that the machined surface quality mainly depends on the size of abrasive particles and processing time. On the contrary, the effect of the load and the rotating speed of semi-bonded abrasive plate or cast iron lapping board are insignificant. The surface quality of workpieces after semi-bonded abrasive machining is better than that after loose abrasives machining.