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先进陶瓷精密高效加工技术基础研究
  • 项目名称：先进陶瓷精密高效加工技术基础研究
  • 项目类别：重点项目
  • 批准号：50535040
  • 申请代码：E0509
  • 项目来源：国家自然科学基金
  • 研究期限：2006-01-01-2009-12-31
  • 项目负责人：袁巨龙
  • 负责人职称：教授
  • 依托单位：浙江工业大学
  • 批准年度：2005
中文摘要：

针对大批量生产的氮化硅陶瓷、蓝宝石单晶等硬脆难加工先进陶瓷材料超光滑无损伤表面高效加工的要求，提出半固着磨粒磨削技术- - 砂轮以液体为结合剂，磨粒靠液体表面张力和粘附力聚集。由于砂轮表层对硬质大颗粒具有"陷阱"效应，可以主动防止大颗粒造成的加工表面的损伤。同时，该技术具有比研磨更高的加工效率，表面加工质量甚至可以达到抛光的水平。本项目综合运用多学科理论和方法，研究半固着磨粒磨削理论和关键技术问题。通过理论分析、实验研究和数值模拟，探索工件表面的损伤及材料去除机理，半固着磨粒砂轮表层、亚表层及内部磨粒与结合剂的力学作用机理，砂轮表面与工件的物理化学作用规律，表层磨粒动力学行为和以及表层"陷阱"效应，揭示先进陶瓷材料高效超精密加工所遵循的主要规律，建立无损伤表面半固着磨粒精密高效削加工的理论和技术体系。

中文主题词： 先进陶瓷;半固着磨粒;陷阱效应;无损伤表面;高效磨削
成果综合统计
成果类型
数量
  • 期刊论文
  • 会议论文
  • 专利
  • 获奖
  • 著作
  • 60
  • 7
  • 0
  • 4
  • 2
期刊论文
Research on the Correlation between the Surface Quality and the Abrasive Grains Wear in Dual-Lapping
Investigation to Semi-Fixed Abrasives Plate Lapping SUS440 Stainless Steel
Lapping of WC-Co Cemented Carbide Ball by Eccentric Dual-Rotating V-Groove Lapping Mode
Research and simulation on the wear uniformity of lapping plate
Simulation of Compacting Process for Semi-Fixed Abrasive Wheel
A Semi-fixed Abrasive Machining Technique
An Investigation to Semi-Fixed Abrasives Plate Characteristics
Observation in the Surface Roughness of Silicon Wafer during Semi-Fixed Abrasive Machining with Larg
半固着磨具孔隙率的理论分析及验证
Research on Ultra-precision Lapping Technology for Super-smooth Surface of KTP Crystal
Simulation Study on the Developed Eccentric V-grooves Lapping Mode for Precise Ball
Study on Pad Conditioning Parameters in Silicon Wafer CMP Process
半固着磨粒加工工艺参数对“陷阱”效应影响的离散元模拟
不锈钢平面的半固着磨粒加工
不锈钢平面的半固着磨具加工的工艺研究
浮力磨粒球性能对工件抛光影响的实验研究
Study on the Mechanical Properties of Sapphire by Numerical Simulation and Nanoindentation Technolog
Processing of WC-Co Cemented Carbide Ball by EDR and RDP Lapping Modes
Surface Lapping by Semi-Bonded Abrasive Grinding Plate for Copper Substrates of Amorphous Ni-Pd-P Al
Study on Fixed Abrasive Lapping Technology for Ceramic Balls
半固着磨具"陷阱"效应的颗粒流模拟
蓝宝石衬底双面研磨的材料去除机理研究
磨粒的几何形状研究综述
Research on Mechanism of Chemical Mechanical Polishing Process for licon Nitride Balls with CeO2 Abr
Study on Roundness Error Correction for the Ceramic Ball in Rotated Dual-plates Lapping Process
Particle Flow Simulation on the Influences of Property Parameters of Semi-Fixed Abrasive Plate on it
Current Situation and Trend of Ultra-precision abrasive machining
超精密加工现状综述
磨粒粒径对蓝宝石研磨均匀性影响的试验研究
CMP 抛光液流场数值仿真
半固着磨具在非晶态Ni-Pd-P合金薄膜铜片衬底精密研磨中的应用
平面研磨抛光轨迹研究
蓝宝石的纳米压痕试验与有限元仿真研究
Semi-Fixed Abrasive Machining for Plane Aluminium
The Characteristic of Organic Bond Grinding Wheel
An Approach to the Influence of Flotative Abrasive Balls on Polishing Process
Machining Characteristics of Semibonded Abrasive Grinding Plate
Study on the Abrasive Effecting Factors of the Removal Rate during Dual-Lapping Sapphire Wafer
Examination to Machining Characteristics of Semi-Fixed Abrasive Plate during the Lapping Process
Study on Semi-Fixed Abrasive Lapping of Ultra-Thin Silver Electrode Layer
Processing of WC-Co Cemented Carbide Balls by Rotated Dual-Plates Lapping Machine
Experimental Validation of the ‘Trap’ Effect of the Semibonded Abrasive Grinding Plate
Simulation on the Indentation of Large Grain in the Semi-Fixed Abrasive Plate with Discrete Element
Simulation and Analysis for Application of Truing Ring in Certain Eccentricity Plane Lapping System
On the Evaluation of Lapping Uniformity for Precision Balls
Comparison of Processing Features between Semi Bonded Abrasive Lapping and Loose Abrasive Lapping
Theoretical Research and Verification on the Porosity of Semi-Fixed Abrasive Tool
Application of Taguchi Method for Optimization of Finishing Conditions in SUS440 Stainless Steel Sub
Experimental Study on the Ultraprecision Lapping Technology of the Copper Substrates for Alloy Films
Parameters Optimization on the Lapping Process for Advanced Ceramics by Applying Taguchi Method
Research on Chemical Mechanical Polishing for Silicon Nitride Ceramics
氮化硅陶瓷球化学机械抛光机理的研究
基于ADAMS的球体双自转研磨方式下研磨盘转速优化研究
双自转研磨沟槽结构参数对球体研磨均匀性的影响分析
半固着磨具“陷阱”效应的颗粒流模拟
超精密加工领域科学技术发展研究
蓝宝石衬底研磨加工中研磨盘材质的影响
蓝宝石晶体的双面研磨加工
半固着磨具“陷阱”效应影响因素分析
会议论文
Subsurface damage Analysis of Single Lapped Sapphire Wafer on Semi-fixed Grinding Plate
Olymball-D600 精密球体研磨机研究与开发
Olymball-E600 精密球体研磨机研究与开发
Experimental Study on the Semibonded Abrasive Machining for SUS440 stainless Steel Substrat
A Particle Flow Code Simulation and Analysis of Property Parameters Influencing ‘Trap’ Effect of Sem
An experimental study of material removal mechanisms in processing of Semibonded abrasive grinding p
An Experimental Study of Semibonded-abrasive-grinding-plate Wear and Workpiece Material Removal in P
获奖
精密球体研磨技术与成套装备的研究开发
球体高效加工技术与装备
球体精密高效加工技术与成套数控装备
高速精密磨削加工关键技术与系列高档数控磨削装备
著作
工程陶瓷材料的加工技术及其应用
《Ultra-precision Machining Technologies 》
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