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蓝宝石衬底双面研磨的材料去除机理研究
  • 期刊名称：中国机械工程，Vol.19 No.23(2008): 2863-2866
  • 时间：0
  • 分类：TG580.1[金属学及工艺—金属切削加工及机床]
  • 作者机构：[1]浙江工业大学机械制造及自动化教育部重点实验室,杭州310014, [2]浙江师范大学,金华321004, [3]湖南大学国家高效磨削工程技术研究中心,长沙410082
  • 相关基金：国家自然科学基金资助重点项目（50535040）;机械制造及自动化教育部重点实验室开放基金资助项目（56310202019）
  • 相关项目：先进陶瓷精密高效加工技术基础研究
关键词： 蓝宝石衬底, 双面研磨, 去除机理, 表面形貌, sapphire substrate , dual- lapping , material removal mechanism, surface topography
中文摘要：

对蓝宝石双面研磨加工进行了实验研究，借助SEM观察被加工工件表面，发现双面研磨加工的工件表面存有磨粒的二体、三体延性和磨损加工痕迹；建立了材料的理论去除模型并进行了计算，且与实验加工值进行了对比。结果表明，蓝宝石双面研磨中同时存在延性去除和脆性去除，该模型可以定性地描述双面研磨加工材料的去除率。

英文摘要：

Experimental researches on material removal mechanism were conducted, and the scanning electron microscope（SEM） was used to scan the processed sapphire surface. The two-body and three-body coupled ductile ＆ brittleness material removal was discovered, then the model of material removal was also set up, and the computation values were contrasted with the experimental ones. Experimental results show that there are ductile removal and brittleness removal simultaneously,and the model can analyze qualitatively the material removal ratio in dual-lapping of sapphire.

同期刊论文项目
先进陶瓷精密高效加工技术基础研究
期刊论文 60 会议论文 7 获奖 4 著作 2
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