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中文摘要：
采用W14、W3．5的B4C磨粒对蓝宝石衬底进行粗研磨和精密研磨的试验研究。对比分析铸铁、合成铜和合成锡盘粗研磨蓝宝石衬底的表面粗糙度和研磨表面均匀性，试验结果表明，铸铁研磨盘获得的蓝宝石衬底宏观表面均匀性和平面度均优于合成铜盘和合成锡盘，经铸铁研磨盘加工后的蓝宝石衬底面型峰谷值误差小于5μm、中心线平均表面粗糙度Ra〈0．82gm。精密研磨试验结果表明，采用合成铜盘和W3．5B4C磨粒有效地改善了蓝宝石衬底表面的均匀性，获得了Ra〈20nm、面型峰谷值误差小于1．6μm的均匀表面，为蓝宝石的超精密研磨奠定了良好的基础。
英文摘要：
In order to investigate the cffcct of lapping plate materials on surface roughness and uniformity, experimental research is performed with W14 and W3.5 boron carbide abrasives for lapping sapphire wafer. In rough lapping process, cast iron, synthetic copper and synthetic tin lapping plate arc used to machine sapphire wafer with W14 boron carbide abrasive, experimental results show that the best macro-uniformity and flatness are achieved by cast iron lapping plate. Sapphire wafer surface with surface error of peak-valley value less than 5μm, standard deviation of roughness less than 0.82μm are achieved. In precision lapping process, synthetic copper lapping plate is used to conduct the experiment with W3.5 boron carbide abrasive, both roughness and uniformity arc greatly improved, a better surface quality with average deviation of roughness less than 20 nm, surface error of peak-vaUey value less than 1.6μm is gotten by precision lapping process, which meet the demands of ultra-precision lapping process.
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