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A review of GaN-based optoelectronic devices on silicon substrate
  • ISSN号:1001-6538
  • 期刊名称:Chinese Science Bulletin
  • 时间:2014.4
  • 页码:1251-1275
  • 分类:TN15[电子电信—物理电子学] TN304.23[电子电信—物理电子学]
  • 作者机构:[1]State Key Laboratory of Optoelectronic Materials andTechnologies, Sun Yat-sen University, Guangzhou 510275,China
  • 相关基金:Acknowledgments This work was supported by the National Basic Research Program of China (2010CB923200 and 2011 CB301903), the National High Technology Research and Development Program of China (201 IAA03AI01), the National Natural Science Foundation of China (61274039 and 51177175), Ph.D. Programs Foundation of Ministry of Education of China (20110171110021), and the Foundation of the Key Technologies R&D Program of Guangdong Province (2010A081002005). Authors also would like to give thanks to their students: Peng Xiang, Minggang Liu, Yibin Yang, Weijie Chen, Guoheng Hu, Yiqiang Ni, Fan Yang, Yao Yao, and Zhiyuan He for their helps.
  • 相关项目:常关型宽禁带氮化镓MOS场效应晶体管的研究
中文摘要:

组III氮化物材料系统拥有一些唯一的性质,例如大光谱范围从对深紫外的、宽精力乐队差距,高电子浸透速度,高电的故障领域,和强壮的极化效果红外线,它启用大家庭让一个很宽的应用程序从 optoelectronic 到力量电子区域。而且,大尺寸硅底层上的陷阱相关的 III 氮化物材料的成功的生长容易启用上述应用认识到商品化,因为基于 Si 的集成电路的站台上的划算的设备制造。在这篇文章,在 Si 底层上种的基于陷阱的材料和轻射出的二极管的进步和发展被总结,在哪个考虑到材料生长的一些关键问题和设备制造被考察。

英文摘要:

Group III-nitride material system possesses some unique properties, such as large spectrum coverage from infrared to deep ultraviolet, wide energy band gap, high electron saturation velocity, high electrical breakdown field, and strong polarization effect, which enables the big family has a very wide application range from optoelectronic to power electronic area. Furthermore, the successful growth of GaN-related III-nitride material on large size silicon substrate enable the above applications easily realize the commercialization, because of the cost-effective device fabrication on the platform of Si-based integrated circuits. In this article, the progress and development of the GaN-based materials and light-emitting diodes grown on Si substrate were summarized, in which some key issues regarding to the material growth and device fabrication were reviewed.

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