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Metal Proportion Optimization of Annular Through-Silicon Via Considering Temperature and Keep-Out Zo
  • 期刊名称：IEEE Trans. on Components, Packaging and Manufactu
  • 时间：2015.8
  • 页码：1093-1099
  • 相关项目：三维集成电路的TSV模型及热管理技术研究
作者： Xiangkun Yin|Zhangming Zhu|Yintang Yang|Ruixue Ding|
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三维集成电路的TSV模型及热管理技术研究
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