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An Effective Approach of Reducing the Keep-Out-Zone Induced by Coaxial Through-Silicon-Via
  • ISSN号：0018-9383
  • 期刊名称：IEEE Transactions on Electron Devices
  • 时间：2014.8
  • 页码：2928-2934
  • 相关项目：三维集成电路的TSV模型及热管理技术研究
作者： Yintang yang|Xiangkun Yin|Xiaoxian Liu|Ruixue Ding|
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三维集成电路的TSV模型及热管理技术研究
期刊论文 21
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