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Accurate Formulas for the Capacitance of Tapered-Through Silicon Vias in 3-D ICs
  • ISSN号：1531-1309
  • 期刊名称：IEEE Microwave and Wireless Components Letters
  • 时间：2014.5
  • 页码：294-296
  • 相关项目：三维集成电路的TSV模型及热管理技术研究
作者： Lu, Qijun|Zhu, Zhangming|Yang, Yintang|Ding, Ruixue|
同期刊论文项目
三维集成电路的TSV模型及热管理技术研究
期刊论文 21
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