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Reduction of Signal Reflection in High-Frequency Three-Dimensional (3D) Integration Circuits
  • ISSN号：1349-2543
  • 期刊名称：IEICE Electronics Express
  • 时间：2013.7.25
  • 页码：1-6
  • 相关项目：三维集成电路的TSV模型及热管理技术研究
作者： Zhangming Zhu|Yintang Yang|Fengjuan Wang|Ruixue Ding|
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三维集成电路的TSV模型及热管理技术研究
期刊论文 21
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