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Electrical Modeling and Characterization of Shield Differential Through-Silicon Vias
  • 期刊名称：IEEE Trans. on Electron Devices
  • 时间：2015.5
  • 页码：1544-1552
  • 相关项目：三维集成电路的TSV模型及热管理技术研究
作者： Qijun Lu|Zhangming Zhu|Yintang Yang|Ruixue Ding|
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三维集成电路的TSV模型及热管理技术研究
期刊论文 21
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