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A Model of Air-Gap Through- Silicon Vias (TSVs) for Millimeter Application
  • ISSN号：1531-1309
  • 期刊名称：IEEE Microwave and Wireless Components Letters
  • 时间：2015.8
  • 页码：493-495
  • 相关项目：三维集成电路的TSV模型及热管理技术研究
作者： Xiaoxian Liu|Zhangming Zhu|Yintang Yang|Ruixue Ding|
同期刊论文项目
三维集成电路的TSV模型及热管理技术研究
期刊论文 21
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