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Performance analysis of single-walled carbon nanotube bundle interconnects for three-dimensional int
  • ISSN号：1750-0443
  • 期刊名称：Micro & Nano Letters
  • 时间：2013.1
  • 页码：56-58
  • 相关项目：三维集成电路的TSV模型及热管理技术研究
作者： Qian, Libo|Zhu, Zhangming|Ding, Ruixue|Yang, Yintang|
同期刊论文项目
三维集成电路的TSV模型及热管理技术研究
期刊论文 21
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