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Temperature properties of the parasitic resistance of through-silicon-vias (TSVs) in high-frequency
  • ISSN号：1349-2543
  • 期刊名称：IEICE Electronics Express
  • 时间：2014.6.30
  • 页码：1-5
  • 相关项目：三维集成电路的TSV模型及热管理技术研究
作者： Yintang Yang|Xiaoxian Liu|Zhangming Zhu|Ruixue Ding|
同期刊论文项目
三维集成电路的TSV模型及热管理技术研究
期刊论文 21
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