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Analytical models for the thermal strain and stress induced by annular through-silicon-via (TSV)
  • ISSN号：1349-2543
  • 期刊名称：IEICE Electronics Express
  • 时间：2013
  • 页码：1-6
  • 相关项目：三维集成电路的TSV模型及热管理技术研究
作者： Zhu, Zhangming|Yang, Yintang|Liu, Xiaoxian|Ding, Ruixue|
同期刊论文项目
三维集成电路的TSV模型及热管理技术研究
期刊论文 21
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