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Type of distortionless through silicon via design based on the multiwalled carbon nanotube
  • ISSN号：1750-0443
  • 期刊名称：Micro & Nano Letters
  • 时间：2013.12
  • 页码：869-871
  • 相关项目：三维集成电路的TSV模型及热管理技术研究
作者： Qijun Lu|Zhangming Zhu|Yintang Yang|Ruixue Ding|
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三维集成电路的TSV模型及热管理技术研究
期刊论文 21
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