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纳米金属颗粒焊膏的合成及其低温烧结连接的电子封装应用研究进展
  • 期刊名称：机械制造文摘
  • 时间：2013
  • 页码：12-16
  • 相关项目：纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理
作者： 周运鸿|闫剑锋|刘磊|吴爱萍|张冬月|母凤文|林路禅|张颖川|赵振宇|
同期刊论文项目
纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理
期刊论文 19 会议论文 27
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