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Special Issue on Nanojoining and Microjoining PREFACE
  • ISSN号：1345-9678
  • 期刊名称：Materials Transactions
  • 时间：2013.6.6
  • 页码：859-859
  • 相关项目：纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理
作者： Zhou, Y. Norman|Hirose, Akio|Zou, Guisheng|Mayer, Michael|Brochu, Mathieu|Jung, Jae-Pil|Hu, Anming|Sano, Tomokazu|
同期刊论文项目
纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理
期刊论文 19 会议论文 27
同项目期刊论文
Mechanism of Low Temperature Sintering-Bonding through In-Situ Formation of Silver Nanoparticles Usi
Nano Brazing of Pt-Ag Nanoparticles under Femtosecond laser Irradiation
Low temperature bonding of Cu metal through sintering of Ag nanotparticles for high temperature pack
微米氧化银膏原位生成纳米银的低温烧结连接
纳米银膏与微米银膏烧结连接对比研究
纳米金属颗粒焊膏的合成及其低温烧结连接的电子封装应用研究进展
Preparation of PVP coated Cu NPs and the application for low-temperature bonding
Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging
Polymer-Protected Cu-Ag Mixed NPs for Low-Temperature Bonding Application
微连接和纳连接的研究新进展
Metal-Metal Bonding Process Using Cu+Ag Mixed Nanoparticles
Highly localized heat generation by femtosecond laser induced plasmon excitation in Ag nanowires
Sintering mechanisms and mechanical properties of joints bonded using silver nanoparticles for elect
纳米银与纳米铜混合焊膏用于电子封装低温烧结连接
Effect of PVP on the low temperature bonding process using polyol prepared Ag nanoparticle paste for
Improvement of Bondability by Depressing the Inhomogeneous Distribution of Nanoparticles in a Sinter
纳米银焊膏的烧结性能及其用于铜连接的研究
Ag2O焊膏中添加镀银铜粉的低温烧结连接及其性能