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Effect of PVP on the low temperature bonding process using polyol prepared Ag nanoparticle paste for
  • 期刊名称：Journal of Physics Conference Series
  • 时间：2012
  • 页码：0120241-0120246
  • 相关项目：纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理
作者： Jianfeng Yan|Guisheng Zou|Aiping Wu|Jiajie Ren|Jiuchun Yan|Anming Hu|Y Norman Zhou|
同期刊论文项目
纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理
期刊论文 19 会议论文 27
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