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Metal-Metal Bonding Process Using Cu+Ag Mixed Nanoparticles
  • ISSN号：1345-9678
  • 期刊名称：Materials Transactions
  • 时间：2013.6.6
  • 页码：879-883
  • 相关项目：纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理
作者： Yan, Jianfeng|Zou, Guisheng|Zhang, Yingchuan|Li, Jiaxin|Liu, Lei|Wu, Aiping|Zhou, Y. Norman|
同期刊论文项目
纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理
期刊论文 19 会议论文 27
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