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Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging
  • ISSN号：1359-6462
  • 期刊名称：Scripta Materialia
  • 时间：2012.4.4
  • 页码：582-585
  • 相关项目：纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理
作者： Yan, Jianfeng|Zou, Guisheng|Wu, Ai-ping|Ren, Jialie|Yan, Jiuchun|Hu, Anming|Zhou, Y.|
同期刊论文项目
纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理
期刊论文 19 会议论文 27
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