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Improvement of Bondability by Depressing the Inhomogeneous Distribution of Nanoparticles in a Sinter
  • ISSN号：0361-5235
  • 期刊名称：Journal of Electronic Materials
  • 时间：2012.7.7
  • 页码：1924-1930
  • 相关项目：纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理
作者： Yan, Jianfeng|Zou, Guisheng|Wu, Aiping|Ren, Jialie|Hu, Anming|Zhou, Y. Norman|
同期刊论文项目
纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理
期刊论文 19 会议论文 27
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