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Low temperature bonding of Cu metal through sintering of Ag nanotparticles for high temperature pack
  • 期刊名称：The Open Surface Science Journal
  • 时间：2011.3.3
  • 页码：70-75
  • 相关项目：纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理
作者： Guisheng Zou|Jianfeng Yan|Fengwen Mu|Aiping Wu|Hailin Bai|Jialie Ren|Anming Hu|Y. Norman Zhou|
同期刊论文项目
纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理
期刊论文 19 会议论文 27
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