综述了形变原位铜基复合材料的制备方法、组织演变及综合性能特点,介绍了该类材料的强化和导电机理。分析指出:形变原位铜基复合材料兼顾了高强度和高导电性,已成为高强高导铜基导电材料研发领域的热点之一,降低生产成本、研究产业化制备工艺、深入完善基础理论是该类材料的发展趋势。最后探讨了该类材料的应用前景。
This paper reviews the fabrication processes of deformation processed Cu-based in-situ composites as well as microstructure evolution and combined properties, introduces the strengthening and electric conduction mechanisms of this materials. It points out that Cu-based in-situ composites possessing high strength and conductivity have become one of hotspots in the field of research on high strength and conductivity Cu-based composites, and lowering product cost, researching fabrication technique of industrialization and perfecting basis theory are development tendency of this materials. It finally presents the potential application of this materials.