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中文摘要：
在Gleeble-1500D热模拟实验机上，在应变速率为0.01～5 /s、变形温度为600～800 ℃条件下，采用高温等温压缩实验对Cu-2.0Ni-0.5Si-0.03P合金的流变应力行为进行研究。结果表明：热模拟实验中，应变速率和变形温度的变化强烈地影响合金流变应力的大小，流变应力随变形温度升高而降低，随应变速率提高而增大；在应变温度为750和800 ℃时，合金热压缩变形流变应力出现明显的峰值应力，表现为连续动态再结晶特征。从流变应力、应变速率和温度的相关性，得出该合金热压缩变形时的热变形激活能和本构方程。
英文摘要：
The flow stress behavior of Cu-2.0Ni-0.5Si-0.03P alloy during hot compression deformation was studied by isothermal compression test at Gleeble-1500D thermal-mechanical simulator at the temperature ranging from 600 ℃ to 800 ℃ and at the strain rate from 0.01 /s to 5 /s. The results show that the flow stress is controlled by both strain rate and deforming temperature, the flow stress decreases with increasing deforming temperature, while increases with increasing strain rate. When the deformation temperature is 750 and 800 ℃, the flow stress decreases after a peak value, showing continuous dynamic recrystallization. Both the hot deformation activation energy and constitutive equation were derived from the correlativity of flow stress, strain rate and temperature.
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