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中文摘要：
研究了时效温度和时效时间对不同冷变形条件下Cu-2.0Ni-0.5Si-0.15Ag合金组织和性能的影响。结果表明,Cu-2.0Ni-0.5Si-0.15Ag合金经900℃×1h固溶处理和不同预冷变形,在450℃和500℃时效处理,第二相呈弥散分布,能获得较高的显微硬度与导电率,析出相为Ni2Si相。当变形量为80%、时效温度达到500℃时,其显微硬度达到252HV0.1,导电率达到45%IACS;合金经40%变形、450℃×4h时效处理后,其抗拉强度达到680MPa。
英文摘要：
The effect of aging temperature and aging time on microstructure and properties of Cu-2. 0Ni-0.5Si-0. 15Ag alloy was studied. The results show that the secondary phase for 1 h and cold rolled followed by aging at 450 ℃ and 500 is dispersive distributed in the alloy after soluting at 900 ℃ ℃ respectively. The secondary phase is Ni2 Si. The high microhardness and electrical conductivity are obtained. The microhardness and electrical conductivity reach 252 HV0. 1 and 45% IACS respectively after the alloy with 80% cold deformation and then aged at 500 ℃. The tensile strength can reach 680 MPa after the alloy with 40% cold deformation and then aged at 450 ℃ for 4 h.
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