综述了引线框架用Cu—Ni—Si合金发展的历史,阐述了Ni-Si元素的质量比及含量对Cu—Ni-Si合金性能的影响.Cu—Ni-Si合金的强化机制及影响其电导率的因素.指出了Cu—Ni—Si合金目前存在的问题及微合金化的Cu-Ni—Si具有成为高强高导引线框架材料的潜力.
This paper reviews the development history of Cu-Ni-Si lead frame material, elaborates the influences of weight ratio and quantities of Ni and Si on Cu-Ni-Si alloy, the strengthening mechanism of Cu-Ni-Si alloy and the effect factors of its electrical conductivity, and analyzes the existing problems of Cu-Ni-Si alloy at present, and puts forward that the tiny alloy Cu-Ni-Si material has the potential of becoming the high strength and high conductivity material for lead frame.