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中文摘要：
采用真空热压制备了W-50%Cu复合材料,对其性能进行了测试,并利用SEM对其微观组织和断口形貌进行了观察与分析。结果表明：在30MPa压力下进行950℃×2h烧结,获得了相对密度达99.6%的W-50%Cu复合材料,其显微硬度、电导率和抗弯强度分别达到133HV、68.9%IACS和285MPa;W-50%Cu复合材料的抗弯断裂表现出塑性断裂特征,其断裂方式主要为沿晶断裂,并伴随少量的穿晶断裂。
英文摘要：
The W-50%Cu composite was prepared by vacuum hot-pressing and its mechanical properties were tested.Using SEM,the microstructure and fracture morphology were observed and analyzed.The results show that W-50%Cu composite with relative density of 99.6% can be prepared under the condition of compaction pressure of 30MPa and sintering temperature of 950℃ for 2h.The microhardness,electrical conductivity and bending strength are 133HV,68.9% IACS,285MPa,respectively.The fracture mode of W-50%Cu composite is ductile fracture,intergranular fracture is the dominant fracture behavior accompanied by a little transgranular fracture.
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