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中文摘要：
形变铜基原位复合材料是一类很具应用潜力的功能材料,是高强度高导电率铜合金的研究热点和发展方向之一,其突出的特点是具有超高的强度和良好的电导率。本文综述了铜基原位复合材料的研究现状,介绍了该类材料的组织演变、强化和导电机理,对其制备工艺及综合性能特点进行了介绍,并阐述了该类材料的发展方向。
英文摘要：
Deformation Cu-based in-situ composites are functional materials with great application potential. Cu-based in situ composites,which have ultra-high strength coupled with good conductivity, are one of the hotspots and developing tendency of high strength and high conductivity copper base composites. Research situation of Cu-based in situ composites was summarized in this paper. The microstructure evolution, strengthening and electric conduction mechanisms of this materials were introduced. The fabrication processes and combined properties of deformation processed Cu-based in situ composites were also summarized. The developing tendency of the composites was finally presented.
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