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中文摘要：
采用简化的内氧化工艺制备了Al2O3／Cu复合材料，研究不同内氧化时间（3～10h）及不同变形量（20％～80％）下的Al2O3／Cu复合材料的显微硬度和导电率，并对其显微组织进行了分析。结果表明：内氧化法制备的Al2O3／Cu复合材料中弥散分布着纳米级的A120，颗粒；复合材料的表面和内部的晶粒大小明显不同，表面晶粒较小（粒径10～30μm）；冷加工变形量越大，Al2O3颗粒与位错的缠结越严重；经900％内氧化制备的Al2O3／Cu复合材料具有良好的导电率和显微硬度。
英文摘要：
Al2O3/Cu composites were prepared by internal oxidation of Cu-Al alloy. The micro-tructure, microhardness and electrical conductivity of the Al2O3/Cu composites prepared with different internal oxidation time and deformation were examined. The results show that Al2O3 nanoparticles disperse in the Al2O3/Cu composites after internal oxidation of Cu-Al alloy. The sizes of grains are obviously different in surface layer compared with inside, the grain size of surface layer is smaller （about 10- 30μm）. With increasing of deformation, density of dislocations increases in the Al2O3/Cu sheets. Al2O3/Cu composites prepared by intemal oxidation of Cu-Al alloy at 900℃ have excellent electrical conductivity and high microhardness.
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