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中文摘要：
为了研究具有多孔结构抛光垫对化学机械抛光（Chemical mechanical polishing，CMP）性能所起的重要作用，通过假定孔质层流体服从Darcy规律，即流动速度正比于压力梯度而反比于粘度，从而提出了CMP中考虑抛光垫特性的三维流体模型，并给出了流动方程。利用多重网格技术和线松驰技术求解上述所得的流动方程，用数值模拟方法探求了不同大小抛光垫孔径和不同孔质层厚度下承载能力和运行参数（包括节距高度、转角和倾角等）的关系。计算结粜表明，当抛光垫的孔径尺寸较小和其孔质层较厚时有较大的承载能力（包括载荷与转矩），从而将提高CMP的材料去除率。孔隙直径较大的抛光垫由于允许较多的流体流过多孔层而导致其承载能力下降。研究结果有助丁了解CMP的作用机理。
英文摘要：
In an effort to explore the contribution of the pad, which is usually full of pores, to the performance of chemical mechanical polishing （CMP）, a three-dimensional flow model of CMP is presented by assuming the fluids in the porous layer complied with Darcy law, i.e., the flow velocity is proportional to the pressure gradient and inverse proportional to the viscosity. The flow equation is deduced accordingly and, by taking advantage of the multilevel technique and line relaxation technique, numerical simulations are carried out to reveal the relationships between the load capacities and operational parameters （including pivot height, roll angle and pitch angle）, under conditions with different porous parameters and different thicknesses of the porous layer. The little porous parameter will lead to prominent increase of load capability （for instance, the load and the moment predicted）, which is still augmented by the thicker layer parameter. This will result in a higher material removal of CMP. A pad full with larger pores will lead deduction in load capability, facilitating the free flow of the fluids through the pores. The research will add some insights to the mechanism of CMP technique.
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