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中文摘要：
使用四种非离子表面活性剂分别添加到以SiO2水溶胶为磨料、H2O2为氧化剂的碱性Cu抛光液中进行抛光实验。结果表明,所选用的非离子型表面活性剂对材料去除率的影响不大,当烷基酚聚氧乙烯醚在质量分数为0.25%时,抛光表面质量提高,表面粗糙度（Ra）由1.354 nm下降到了0.897 6 nm,同时有效地减轻了Cu抛光表面的划痕和腐蚀,其原因是聚氧乙烯链可以通过醚键与水分子形成氢键,在聚氧乙烯周围形成一层溶剂化的水膜保护了被吸附表面。
英文摘要：
In order to study the effectiveness of surfactant in copper polishing slurry, four kinds of nonionic surface active agent were added in copper polishing slurry taking silica sol as the abrasive and H2O2 as the oxidizer in experiments respectively. The results indicate that four kinds of nonionic surface active agent have little influences on the material removal rate. When the weight percentage of alkylphenol ethoxylates is 0.25%, the polishing surface quality is improved. The surface roughness will drop from 1.354 nm to 0. 897 6 nm, and the nick and corrosion of copper polishing surface are alleviated effectively. The reason is that poly can engender hydrogen bond with water molecules by ether link, so the adsorbed surface is protected by salvation water film which forms around poly.
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