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中文摘要：
对ULSI制造中的层间介质化学机械抛光的发展趋势和要求进行了讨论，分析了铜化学机械抛光的材料去除过程、影响因素和抛光液的重要作用，讨论了酸性和碱性两种铜抛光液的组成和一些组分的功能，对研究铜化学机械抛光的电化学手段进行了阐述和机理分析，指出了铜化学机械抛光今后的研究趋势和重点以及抛光液研究的发展方向。
英文摘要：
The development trend and demand of interlayer medium CMP were discussed. Material removal process and infection factor of copper CMP were analyzed, the important effect of slurry was also analyzed. Two kinds of acidity and alkalescence copper slurry were discussed on their Composing and some constituent functions. Electrochemistry means of copper CMP was expounded and analyzed. The research and development trends for copper CMP and the slurry were pointed out.
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