研究了Ar^+刻蚀对InGaAs,n-InP和p-InP表面的损伤,并用湿法腐蚀后处理消除损伤.Ar^+刻蚀后InGaAs表面均方根粗糙度较小,而n-InP和p-InP表面明显变粗糙.刻蚀后InGaAsPL强度增加,而n-InP和p-InPPL强度都减小.用XPS分析了未刻蚀、Ar^+刻蚀和湿法腐蚀后处理三种情况下样品表面原子含量.刻蚀后InGaAs表面In和Ga含量明显增加,n-InP和p-InP表面有严重P缺失.湿法腐蚀后,样品表面原子含量和未刻蚀前基本一致.
Surface damage on InGaAs, n-InP, and p-InP after Ar^+ etching is studied, and it is removed by wet etching post treatments. After Ar^+ etching, the root-mean-square roughness of InGaAs surface is lower, but the roughness of n-InP and p-InP surfaces is significantly higher. The photoluminescence (PL) intensity of Ar^+ -etched InGaAs increases, but those of Ar^+ - etched n-InP and p-InP decreases. X-ray photoelectron spectroscopy (XPS) is used to investigate the atomic concentration of three samples before Ar^+ etching and after Ar^+ etching and wet etching post treatments. After Ar^+ etching,the content of In and Ga at the InGaAs surface increases markedly, and there is generally a preferential loss of P from n-InP and p-InP surfaces. The surface atomic concentration of the samples after wet etching is almost the same as before Ar^+ etching.