深入研究了GaP材料在高密度感应耦合等离子体刻蚀系统中刻蚀选择比和刻蚀速率随刻蚀系统的源功率、射频功率、腔室压强的变化规律,即通过改变其中一个参数而保持其它参数不变来得出变化规律;同时将刻蚀GaP材料应用到红光LED制作,即电流阻挡层和表面粗化这两种工艺中,通过大量试验,得到了刻蚀形貌和最优的刻蚀条件,制作阻挡层的最优条件为:BCl3流量比为3/1,ICP功率为600W,RF功率为100W,腔室压强为1.0×10-2Pa;表面粗化时只用BCl3气体刻蚀,表面粗化后LED的光强提高了30%。
Inductively coupled plasma(ICP)etching rate and selectivity for GaP are deeply investigated as a function of chamber pressure,RF power,and ICP source power.Meanwhile,the etched profile and the surface morphology are studied in the process of the current-blocking layer fabrication and surface-roughened fabrication.Finally the optimized processing parameters are obtained,that is,the BCl3 flow rate is 3/1,the ICP power is 600W,the RF power is 100W,the chamber pressure is 1.0×10-2 Pa.In the process of surface-r...