中文摘要：

采用扫描电镜、能谱仪和微拉伸实验,研究了Cu/Sn-3Ag-0.5Cu/Cu引线对接焊点在373K不同热时效时间下焊点界面金属间化合物（IMC）的生长和抗拉强度的变化,同时对互连焊点的断口形貌及断裂模式进行了分析。结果表明：随着时效时间的延长,1）界面IMC不断增厚,其生长动力学符合抛物线生长规律;2）互连焊点的抗拉强度不断下降,其断裂模式由纯剪切断裂逐渐向微孔聚集型断裂转变。

英文摘要：

The butting solder joint of Cu/Sn-3.0Ag-0.5Cu/Cu was used to investigate the growth of the interfacial intermetallic compound（IMC） and the evolution of tensile strength of solder joint at 373 K at different aging time,by SEM equipped with EDS and micromechanical testing.Meanwhile,the fracture morphology and fracture mode of solder joint was also evaluated.The results show that with the increase of aging time,the IMC thickens constantly,the dynamics of its growth follows parabolic growth rule;the ultimate tensile strength of the solder joint continuously declines,and the fracture mode gradually transforms from pure shear fracture into micro-void accumulation fracture.