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中文摘要：
研究了Sn-3A分旬．5Cu-xBi（x=0，1，3）／Cu钎焊接头在140和195℃时效过程中的剪切强度变化．结果表明：随着时效时间的增加，界面金属间化合物（IMG）层的厚度逐渐增加；140℃时效时，Sn-3Ag-0.5Cu接头的剪切强度随时效时间延长变化不大，Bi元素的添加提高了钎焊接头的剪切强度；195℃时效时，钎焊接头剪切强度均随时效时间延长而下降，Bi元素的添加对接头剪切强度的影响不明显．剪切断口分析表明：随着界面化合物层厚度的增加，断裂机制逐渐由韧性断裂变为脆性断裂，较高剪切强度对应于钎料基体的韧性断裂，而低剪切强度对应于钎料与界面化合物层之间的脆性断裂．
英文摘要：
The changes of shear strengths of Sn-3Ag-0.5Cu-xBi（x=0, 1, 3）/Cu solders joints during aging at 140 and 195 ℃ have been studied. The results indicated that with increasing aging time the thickness of intermetallics at interface increased and fracture type changed from ductile fracture to brittle fracture. Shear strength for Sn-3Ag-0.5Cu solder joints changed slightly when aged at 140 ℃, but after adding Bi the shear strength increased first and then droped with prolonging the aging time. When aged at 195 ℃, shear strengths of all solder joints decreased with prolonging the aging time, Bi addition has no obvious effect. The higher shear strength is corresponding to ductile fracture of solder matrix and the lower shear strength to brittle fracture between solder and intermetallics.
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