中文摘要：

研究了Sn-3.0Ag-0.5Cu/Cu焊点分别在1、5、10min焊接时间后在373、403、438K时效温度下焊点界面IMC的生长和剪切强度随时效时间的变化,同时对焊点断口形貌及断裂模式进行了分析。结果表明,焊接时间越长,界面IMC层越厚。随着时效时间的延长,界面IMC不断增厚,其生长动力学符合抛物线生长规律,生长激活能为75.03kJ/mol;焊点剪切强度随时效时间增加不断下降,其断裂方式从开始的韧性断裂逐渐转变为局部脆性断裂。

英文摘要：

Growth of the interfacial intermetallic compound（IMC） and the evolution of shear strength of the Sn-3.0Ag-0.5Cu/Cu joints with welding for 1,5,10 min and aging at 373,403,438 K,respectively,were investigated by optical microscope（OM） and SEM（scanning electron microscope）.Meanwhile,fracture morphology and fracture mode of the solder joints were also analyzed.The results show that with the increase of welding time,the thickness of the IMC layer is increased.With increasing in aging time,IMC thickens is increased,and its growth dynamics follows a parabolic growth pattern,and the growth activation energy is 75.03 kJ/mol.The shear strength of solder joints is decreased with extending in aging time.The fracture mode is transformed from the ductile fracture into local brittle fracture gradually.