中文摘要：

钎焊和扩散焊制备的Sn／Cu接头在无磁场下不同温度时效，研究接头界面处金属间化合物（IMC）层的生长行为。结果表明：两种接头界面IMC层在时效初始时刻的横截面和形貌均不同，在时效过程中的生长行为类似，钎焊和扩散焊接头界面IMC层的生长激活能分别为116和94kJ／mol。为研究强磁场对界面IMC层生长行为的影响，两种试样在190℃、磁场强度为8T时效。实验结果表明：两种接头界面IMC层的生长动力学相同，但晶粒形貌和晶体取向差别明显。

英文摘要：

The growth behaviors of interfacial intermetallic compound （IMC） layers in soldered and diffusion bonding Sn/Cu joints during aging and the effect of high magnetic field were investigated. The results show that the cross sections and morphologies of IMC layers in soldered and diffusion-bonding joints before aging are different. The growth behaviors of these two IMC layers are similar when these joints are aged without magnetic field. The growth activation energies for the two IMC layers are 116 and 94 kJ/mol, respectively. In order to study the effect of high magnetic field on the growth behavior of IMC layers, the samples were aged at 190℃ in 8 T of high magnetic field strength. The results show that there exit unobvious difference between the growth kinetics of IMC layers in the two joints. However, the morphologies and orientations of IMC layers in these two joints change by high magnetic field.