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中文摘要：
研究了时效和焊盘处理方式（OSP、Ni/Pd/Au）对BGA（球栅封装阵列）无铅焊点力学性能、IMC（界面化合物）生长及断裂机制的影响。结果表明：随着时效时间的延长,温度的升高,焊点的强度降低,IMC增厚,断裂亦由韧性断裂向脆性断裂转变;在相同条件下,焊点（Ni/Pd/Au）的剪切强度高于OSP处理的焊点。
英文摘要：
The effects of aging and pad finish（OSP,Ni/Pd/Au） on mechanical property,intermetallic compound（IMC） at the interface and fracture mode of lead-free solder joints of ball grid array（BGA） were investigated.The results indicate that the mechanical property decreases with the increase of aging time and temperature,the IMC thickness increases and the fracture mode changes from ductile to brittle.Under the same conditions,the shear strength of the joints with electroless nickel and palladium/immersion gold（Ni/Pd/Au） on PCB is higher than organic solderability preservative（OSP） finish.
同期刊论文项目
同项目期刊论文
Wetting behavior and interfacial reactions in (Sn-9Zn)-2Cu/Ni joints during soldering and isothermal
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