在对微/纳机电系统进行机械力学特性研究和可靠性测试时,经常需要获取结构的表面3.D轮廓.然而.使用显微干涉法测量微/纳结构的表面3-D轮廓通常会存在一定的倾斜误差,这种误差在某些应用中是不允许的.为了弥补传统的调平补偿方法的局限性,提出了一种基于最小二乘法和坐标变换的倾斜补偿方法:在处理图像时,先用最小二乘法确定一个基准平面,然后旋转直角坐标系使得新坐标系的xoy平面与基准平面平行即可达到调平被测表面而补偿倾斜误差的目的.通过具体应用实例证实了这种补偿方法是有用、灵活而精确的.
3-D surface profile measurement of micromachined structures is often necessary in mechanical properties characterization and reliability test of micro/nano electromechanical systems. However, tilt errors always occur when 3-D profile of a structure is obtained using microscopic interferometry, which is unbearable in some applications. In order to cover the shortages of traditional leveling method, a robust approach based on least square method and coordinate conversion is proposed to level the surface under test, which analyzes the images by finding a reference plane with least squares fit and rotates the coordinates in order that the new xoy plane is parallel to the reference one and then tilt errors are compensated. Successful application of the compensation method in an example verifies that it is useful, flexible and accurate.