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中文摘要：
MEMS耐高温压力传感器在封装结构上采用薄膜隔离式结构,在油腔与波纹片所形成的密闭容腔里面填充高温硅油。由于传感器的工作温度达250℃,硅油、壳体基座及波纹片将会产生不同程度的热膨胀,最终将给压阻力敏芯片形成一定附加压力,严重影响传感器的精度。文中主要就硅油、壳体基座及波纹片在250℃工作时由于不同的热膨胀系数而导致的膨胀不一致情况进行ANSYS仿真分析,研究了平膜膜片及波纹状膜片情况下的硅油热膨胀问题,最后相应地得到了硅油相对于壳体和波纹片的热膨胀率,同时分析得出了合理设计波纹片结构可以有效减小硅油热膨胀时所产生的附加压力,提高传感器的工作灵敏度与稳定性。
英文摘要：
The MEMS high temperature pressure transducer is film isolated in packaging structure. The high temperature oil is filled into the confined cavity formed by wavy tablets and base frame. Because the working temperature of sensor is 250 ℃, Sili- cone oil, base frame and wavy tablets will produce different degrees of thermal expansion. Eventually, it will produce a certain ad- ditional pressure on piezoresistive chip, which will interference the transducer accuracy. This paper mainly studied the thermal ex- pansion on silicone oil, base frame and wavy tablets in 250 ℃. Finite element method was applied to analysis the expansion and the last corresponding degrees of thermal expansion of silicone oil was achieved under two different shapes of tablets, which were flat tablets and wavy tablets. Meanwhile, through analysis it achieved that the reasonable design of wavy tablets will effectively re- duce the additional pressure to improve the stability and accuracy of transducer.
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