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中文摘要：
在热压印过程中,模板和基体上的聚合物直接物理接触,压印压力、温度和时间是决定压印效果的主要因素。模板是否完全填充,对压印质量有着至关重要的影响,为了获得正确的压印参数,有必要了解在热压印过程中的聚合物流动机理。文中使用Ansys有限元软件数值仿真热压印过程中的相关问题。首先,建立超弹模型,仿真分析热压印过程中压力与聚合物变形的关系,仿真结果表明,单纯提高压力对改善压印效果并不明显。其次,研究冷却降温过程中聚合物应力分布情况,研究显示降温过程中存在应力集中,因此,在热压印时应该在玻璃点温度以上去除压力,避免压印缺陷产生。最后,仿真分析模板热膨胀系数对压印结果的影响,结果表明,由于模板与光刻胶热膨胀系数不同,在降温过程中存在应变集中现象。因此,应该选择热膨胀系数与光刻胶尽量接近的材料作为模板。
英文摘要：
During hot-embosssing process,direct physical contact of the mold and substrate occurs,and during the process,pressure,temperature and time are important for the imprinting quality.Completely filling up the mold is crucial to the pattern-replication.In order to apply proper parameters to hot-embossing process,it is necessary to well understand the flux mechanism of the polymer.Numerical simulation using Ansys software was carried out.First,hyperelastic model was set up to study the relationship between polymer deformation and pressure.The results indicate that inceasing the pressure only can not improve the hot-embossing performance obviously.Second,the polymer stress distribution in cooling down step reveals that stress convergence exsits,which means that pressure removal above the transition temperature of the polymer glass could avoid imprint defects.Finally,influence of different thermal expansion coefficient between mold and polymer was investigated.The results indicate strain convergence was produced in cooling down by thermal expansion coefficient difference of mold and photoresist.Hence it is better to select material of the mold, which has similar expansion coefficient with that of the photoresist.
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