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Reducing Cu diffusion in SiCOH low-k films by O2 plasma treatment
  • 期刊名称：Microelectronic Engineering
  • 时间：0
  • 页码：2119-2122
  • 语言：英文
  • 相关项目：低气压多频等离子体与材料表面相互作用
作者： Chao Ye|Yijun Xu|Zhenyu Xing|Jing Yuan|Zhaoyuan Ning|
同期刊论文项目
低气压多频等离子体与材料表面相互作用
期刊论文 80 会议论文 8
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