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考虑电感效应和工艺波动影响的互连延时建模与计算
  • 期刊名称:西安电子科技大学学报,2010, 37(3): 513-519. (EI:2010271306296
  • 时间:0
  • 分类:TN405.97[电子电信—微电子学与固体电子学]
  • 作者机构:[1]西安电子科技大学宽禁带半导体材料与器件教育部重点实验室,陕西西安710071
  • 相关基金:国家自然科学基金资助项目(60606006);国家杰出青年基金资助项目(60725415)
  • 相关项目:集成电路设计(包括CAD)
中文摘要:

基于改进的RLC互连树等效Elmore延时模型,建立了考虑电感效应和工艺波动影响的互连延时统计模型,并推导出计算互连延时均值与标准差的计算公式.计算结果表明,与目前广泛应用的MonteCarlo分析方法相比,采用新模型计算得到的RLC互连延时均值误差低于1.27%,标准差误差则低于5.23%,而且计算耗时仅为1000次以上MonteCarlo分析的0.01%.

英文摘要:

A statistical interconnect delay model considering the influence of inductance effect and process fluctuations is presented according to the improved equivalent Elmore delay, and the expressions for mean and standard deviation of interconnect delay are obtained. Calculated results indicate that the errors of the mean and standard deviation are less than 1.27% and 5.23% respectively in comparison with the results calculated by the widely used Monte Carlo method, and at the same time, the time elapsed for computing by using the proposed method is less than one ten-thousandth of that for 1 000 computations by using the Monte Carlo method.

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